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TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.

QinetiQ Achieves UK’s First Jet-to-Jet Teaming Between Aircraft and Autonomous Drone

04/29/2024 | QinetiQ
QinetiQ has successfully trialled the UK’s first Crewed-Uncrewed-Teaming demonstration between a crewed aircraft and an autonomous jet drone.

Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract

04/26/2024 | Lockheed Martin
Lockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).

Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design

04/25/2024 | Cadence Design Systems
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.

Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products

04/24/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
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